电子封装技术专业
一、培养目标
Ⅰ. Program Objective
本专业面向国家集成电路和光电子产业需求，培养身心健康、具有良好的思想品质与职业道德、了解中国国情、拥有国际视野与高度社会责任感，适应社会经济发展需求的富有创新精神的高素质复合型人才。学生系统学习电子制造科学与工程领域的基础理论及工程应用知识，能够从事集成电路制造、电子封装技术、电子制造装备及电子工艺材料等领域的科学研究、技术开发、设计制造、企业管理等工作。毕业后，经过磨练，能够逐步成长为社会的领军人物。
预期五年以上的毕业生：
（1）能够系统应用电子封装技术专业基础理论知识，具有较强的从事相关专业领域科学研究的能力；
（2）能够应用电子封装技术专业的技术知识，解决本专业及相关领域的复杂工程问题；
（3）具有较强的团队合作意识、沟通与交流能力、社会责任感，能够组织协调及科学管理多学科项目与团队；
（4）具有优良的道德品质、科学素质与人文修养，热爱祖国、在工程实践中能够综合考虑伦理、社会与环境、可持续发展等因素；
（5）具有良好的终身学习、国际视野及开拓创新意识；
（6）具有良好的服务意识，履行社会与公共责任。
This program meets the needs of national emerging strategic industries of Integrated Circuit and Optoelectronic industries. It aims to cultivate high-quality compound talents with innovative spirit, good physical and mental health, good ideological quality and professional ethics, understanding of China's national conditions, international perspective and high sense of social responsibility, and adapting to the needs of social and economic development. The students need to systematically master the basic theory and application knowledge of Electronic Manufacturing Science and Engineering, and can engage in the scientific research, technology development, design and manufacturing, enterprise management of integrated circuit manufacture, electronic packaging, electronic manufacturing equipments and electronic technology materials, etc. After graduation, through hard work and training, the students can gradually grow into a leading figure in society.
Expect students can achieve the following goals after graduated more than five years:
(1) Ability to systematically apply the basic theoretical knowledge of natural sciences and electronic packaging technology, and have a strong ability to engage in scientific research in related fields of specialization;
(2) Ability to apply electronic packaging expertise to solve complex engineering problems in this and other related fields;
(3) Strong teamwork awareness, communication and communication skills, sense of social responsibility, able to organize, coordinate and scientifically manage multidisciplinary projects and teams;
(4) With excellent moral character, scientific quality and humanistic accomplishment, loving of motherland, can comprehensively consider such factors as ethics, society and environment, and sustainable development in engineering practice;
(5) Have a good lifelong learning, international perspective and pioneering and innovative awareness;
(6) Have a good sense of service, fulfill social and public responsibility.
二、基本规格要求
Ⅱ. Learning Outcomes
本专业主要学习电子制造科学与工程和材料工程两个领域的基础理论和应用技术，毕业生应获得如下几个方面的知识和能力：
（1）能够将数学、自然科学、工程基础和专业知识用于解决复杂工程问题。
（2）能够应用数学、自然科学和工程科学的基本原理，识别、表达、并通过文献研究分析复杂工程问题，以获得有效结论。
（3）能够设计针对复杂电子制造工程问题的解决方案，设计满足特定需求的系统、单元（部件）或工艺流程，并能够在设计环节中体现创新意识，考虑法律、健康、安全、文化、社会以及环境等因素。
（4）能够基于科学原理并采用科学方法对复杂电子制造工程问题进行研究，包括设计实验、分析与解释数据、并通过信息综合得到合理有效的结论。
（5）能够针对复杂电子制造复杂工程问题，开发、选择与使用恰当的技术、资源、现代工程工具和信息技术工具，包括对复杂工程问题的预测与模拟，并能够理解其局限性。
（6）能够基于工程相关背景知识进行合理分析，评价电子制造工程实践和复杂电子制造工程问题解决方案对社会、健康、安全、法律以及文化的影响，并理解应承担的责任。
（7）能够理解和评价针对复杂电子制造工程问题的工程实践对环境、社会可持续发展的影响。
（8）具有人文社会科学素养、社会责任感，能够在工程实践中理解并遵守工程职业道德和规范，履行责任。
（9）能够在多学科背景下的团队中承担个体、团队成员以及负责人的角色。
（10）能够就复杂工程问题与业界同行及社会公众进行有效沟通和交流，包括撰写报告和设计文稿、陈述发言、清晰表达或回应指令。并具备一定的国际视野，能够在跨文化背景下进行沟通和交流。
（11）理解并掌握工程管理原理与经济决策方法，并能在多学科环境中应用。
（12）具有自主学习和终身学习的意识，有不断学习和适应发展的能力。
As a student of this program, you will gain:
(1) Able to apply knowledge of mathematics, natural science, engineering fundamentals and expertise to solve complex engineering problems.
(2) Identify, formulate, research on literature and analysis complex engineering problems to reach substantiated conclusions using basic principles of mathematics, natural sciences and engineering sciences.
(3) Find solutions for complex electronic manufacturing engineering problems and design innovative systems, units (components) or processes that meet specific requirements. The solution and design shall factor in legal, health, safety, culture, society, and environmental perspectives.
(4) Conduct investigations of complex electronic manufacturing engineering problems using research-based knowledge and research methods including design of experiments, analysis and interpretation of data, and synthesis of information to obtain reasonable and effective conclusions.
(5) Create, select and apply appropriate techniques, resources, and modern engineering and information analytical tools for complex electronic manufacturing engineering problems, including prediction and simulation of complex engineering problems, and understand their limitations.
(6) Assess appropriately on societal, health, safety, legal and cultural impact and the consequent responsibilities relevant to professional engineering practice and solutions to complex electronic manufacturing engineering problems.
(7) Understand and evaluate the impact of engineering practice on complex electronic manufacturing engineering problems on environmental and social sustainable development.
(8) Apply ethical principles and commit to professional ethics and responsibilities and norms of engineering practice.
(9) Ability to assume the role of individual, team members, and principals in a multidisciplinary team.
(10) Communicate effectively on complex engineering activities with the engineering community and with society at large, such as being able to comprehend and write reports and documentation, make effective presentations, and give and receive clear instructions. Possess a certain degree of global outlook, and be able to communicate across different cultures.
(11) Obtain knowledge and understanding of engineering management principles and economic decision-making, and apply these to work.
(12) Recognize the demand, and have the preparation and ability to engage in independent and life-long learning in the broadest context of technological change.
