|
书籍及章节
Xiaobing Luo, Jingjing Zhang, Bin Xie, Spectra Design and Packaging Optimization for White Light-emitting Diodes with High Luminous Efficiency and Color Performance, Science Press, Beijing, Dec. 2017
Sheng Liu, Xiaobing Luo, LED Packaging for Lighting Applications-Design, Manufacturing and Testing, John Wiley & Sons, USA, 2011 Xiaobing Luo, Run Hu, Chip Packaging: Encapsulation of nitride LEDs, Chapter 15, Woodhead Publishing, UK, 2014 Xiaobing Luo, Run Hu, Thermal management on LED packaging and applications, Chapter 9, Annual Review of Heat Transfer: 371-414, USA, 2015 Xiaobing Luo, Qi Chen, Online Testing Method and System for LED Reliability and Their Applications, Chapter 13, Solid State Lighting Reliability Part 2: 353-380, Springer, Switzerland, 2018 |
