18luck新利电竞主页平台管理系统 ZHU FU LONG--英文主页--Paper Publications

朱福龙

Recommended Ph.D.Supervisor Recommended MA Supervisor

·Paper Publications

Current position: 英文主页 > Scientific Research > Paper Publications

[1] Fulong Zhu*, Xinxin Lin, Wei Zhang, Jiajie Fan, Sheng Liu, “Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique”, IEEE Access, v6, p33099-33110, 2018. (SCI,EI, DOI:10.1109/ACCESS. 2018. 2842199,*Corresponding author).
[2] Yixin Xu, Fulong Zhu*, Miaocao Wang, Xiaojian Liu, Sheng Liu, “Molecular Dynamics Simulation on Grinding Process of Cu-Si and Cu-SiO2 Composite Structures”, in 19th International Conference on Electronic Packaging Technology, ICEPT 2018..
[3] Miaocao Wang, Fulong Zhu, Yixin Xu, Sheng Liu, “Investigation of the differences in nanometric grinding of SiC and Si by molecular dynamics”, in 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018, p434-437, 2018. (EI, DOI:10.23919/ICEP. 2018. 8374341).
[4] Yongjun Pan, Fulong Zhu*, Jiajie Fan, Jiaquan Tao, Xinxin Lin, Fengren Wang and Lang Shi, “Investigation of mechanical properties of silicone/phosphor composite used in light emitting diodes package”, Polymers, v10, n2, p195, 2018. (SCI,EI, DOI: 10.3390/polym10020195).
[5] Yongjun Pan, Fulong Zhu*, Xinxin Lin, Jiajie Fan and Sheng Liu, “Comparison of Ultrasonic Wire Bonding Process between Gold and Copper by Nonlinear Structure Analysis”, Journal of Adhesion Science and Technology, v32, n18, p 2007-2018, 2018. (SCI.EI, DOI: 10.1080/01694243.2018.1463651).
[6] Yongjun Pan, Fulong Zhu*, Xinxin Lin, Jiaquan Tao, Liping He, Han Wang, Sheng Liu, “Comparing the copper and gold wire bonding during thermalsonic wire bonding process”, in 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p 240-243, 2016. (EI, DOI: 10.1109/ICEPT. 2016. 7583127).
[7] Yongjun Pan, Fulong Zhu*, Jiajie Fan, Xinxin Lin, Jiaquan Tao and Sheng Liu, “Thermal-mechanical analysis of high power LED packaging during power cycling test”, 2017 18th International Conference on Electronic Packaging Technology, ICEPT 2017, p1-5, 2017. (EI, DOI: 10.1109/ICEPT.2017.8046394).
[8] Yongjun Pan, Fulong Zhu*, Jiajie Fan, Xinxin Lin, Fengren Wang, Lang Shi, Yan Kan and Sheng Liu, “Reliability prediction of LED packaging by fatigue behavior of bonding wire in power cycling accelerated test”, in 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017, p1-4, 2017. (EI, DOI: 10.1109/EPTC.2017.8277431).
[9] Xinxin Lin, Fulong Zhu*, Liping He, Yongjun Pan, Jiaquan Tao, Ke Duan, “Subsurface damage mechanism of wafer thinning process revealed by molecular dynamics simulation”, in 2016 17th International Conference on Electronic Packaging Technology, ICEPT2016, p417-420, 2016 (EI, DOI:10.1109/ICEPT. 2016.7583166).
[10] Zhu Fulong*, Kan Yan, Kan Tang, Sheng Liu, “Investigation of Thermal Properties of Ni-Coated Graphene Nanoribbons Based on Molecular Dynamics Methods”, Journal of Electronic Materials, v46, n8, p.4733-4739, 2017.(SCI,EI, DOI: 10.1007/s11664-017-5542-5).

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