18luck新利电竞主页平台管理系统 ZHU FU LONG--英文主页--Paper Publications

朱福龙

Recommended Ph.D.Supervisor Recommended MA Supervisor

·Paper Publications

Current position: 英文主页 > Scientific Research > Paper Publications

[31] Youkai Chen, Fulong Zhu*, Kai Tang, Ying Li, Hengyou Liao, Xiahui Chen, Sheng Liu, “Mechanical Properties Investigation of Graphene Coated with Ni”， the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013, p756-759,2013.( EI, DOI: 10.1109/EPTC.2013.6745822).
[32] Hengyou Liao, Fulong Zhu*, Sheng Liu, “Mechanical stretching behavior simulation of SWCNT and SWCNT-Ni”, 2011 International Symposium on Advanced Packaging Materials, APM 2011, p85-90, 2011. (EI, DOI: 10.1109/ISAPM.2011.6105677).
[33] Hengyou Liao, Fulong Zhu*, Wei Zhang, Chen Youkai; Song Shao; Liu Sheng, “Tensile behaviors investigation of SWCNT-Ni with vacancies”，2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP2012, p294-297, 2012. (EI, DOI:10.1109/ICEPT-HDP. 2012.6474621).
[34] Hengyou Liao, Fulong Zhu*, Wei Zhang, Chen Youkai; Song Shao; Liu Sheng, “Torsion behavior simulation of Ni-coating SWCNT based on molecular dynamics”. 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, p1155-1158, 2012. (EI, DOI: 10.1109/ICEPT-HDP.2012.6474812).
[35] Shao Song, Fulong Zhu*, Wei Zhang, Sheng Liu, “Warpage measurement of various substrates based on white light shadow Moiré technology”, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011, p389-392, 2011. (EI, DOI:10.1109/IMPACT. 2011.6117161).
[36] Zhaohui Chen, Shengjun Zhou, Zhicheng Lv, Chuan Liu, Xing Chen, Xiao Jia, Ke Zeng, Bin Song, Fulong Zhu, Mingxiang Chen, Xuefang Wang, Honghai Zhang, Sheng Liu, “Expert advisor for integrated virtual manufacturing and reliability for TSV/SiP based modules”, 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011, p1183-1189, 2011. (EI, DOI: 10.1109/ECTC.2011.5898660).
[37] Dan Xie, Honghai Zhang, Sheng Liu, Fulong Zhu, Sheng Tao, “Mechanical Properties Investigation of PMMA PC and PS during Thermal Nanoimprinting”, 2008 4th International Symposium on Precision Mechanical Measurements, v7130, 2008. (EI,DOI: 10.1117/12.819561).
[38] Fulong Zhu*, Shao Song, Wei Zhang, Sheng Liu, “Creep behavior investigation of lead-free solder alloy Sn96.5Ag3Cu0.5”， 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, p195-198, 2010.(EI, DOI: 10.1109/ICEPT.2010.5582445).
[39] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Investigation of Microstructures and Tensile Properties of a Sn-Cu Lead-free Solder Alloy”, Journal of Materials Science: Materials in Electronics, v17, n5, p379-384, 2006.( SCI, EI, DOI: 10.1007/s10854-006-7474-3).
[40] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “the Effect of Temperature and Strain Rate On the Tensile properties of a Sn99.3Cu0.7(Ni) Lead-free Solder Alloy”, Microelectronic Engineering, v84, n1, p144-150, 2007.( SCI, EI, DOI: 10.1016/j.mee.2006.09.031).

total53 4/6

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