18luck新利电竞主页平台管理系统 ZHU FU LONG--英文主页--Paper Publications

朱福龙

Recommended Ph.D.Supervisor Recommended MA Supervisor

·Paper Publications

Current position: 英文主页 > Scientific Research > Paper Publications

[21] Ke Duan, Fulong Zhu*, Ying Li, Kai Tang, Sheng Liu, Yanming Chen, “Contact Resistance Investigation of Electrical Connector with Different Shrink Range”, in 2014 15th International Conference on Electronic Packaging Technology, ICEPT2014, p1146-1149, 2014. (EI, DOI:10.1109/ICEPT.2014. 6922846).
[22] Ke Duan, Fulong Zhu*, Mingxiang Chen, Ying Li, Yanming Chen, “Warpage Analysis of DBC Substrate based on Non-contact Shadow Moiré Technology”, 2014 The 15th International Conference on Electronic Packaging Technology, ICEPT2014, p1427-1430,2014.( EI, DOI: 10.1109/ICEPT.2014.6922923).
[23] Kai Tang, Fulong Zhu*, Ying Li, Ke Duan, Sheng Liu, Yanming Chen, “Effect of Defects on Thermal Conductivity of Graphene”, 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014, p592-595, 2014. ( EI, DOI: 10.1109/ICEPT.2014.6922725).
[24] Kai Tang, Fulong Zhu*, Youkai Chen, Ying Li, Hengyou Liao, Sheng Liu, “Molecular Dynamics Simulation on Thermal Conductivity of Single-Walled Carbon Nanotubes”, 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, p583-586, 2013.( EI, DOI: 10.1109/ICEPT.2013.6756538).
[25] Kai Tang, Fulong Zhu*, Youkai Chen, Ying Li, Hengyou Liao , Xiahui Chen, Sheng Liu, “Effect of Vacancy Defects on Thermal Conductivity of Single-walled Carbon Nanotube”, 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC2013, p817-820, p2013. ( EI, DOI: 10.1109/EPTC. 2013.6745835).
[26] Fulong Zhu*, Kai Tang, Ying Li, Ke Duan, Sheng Liu, Yanming Chen, “Heat conduction study across metal/graphene interface by molecular dynamics”, 2014 16th IEEE Electronics Packaging Technology Conference, EPTC2014, p833-836, 2014. ( EI, DOI: 10.1109/EPTC.2014.7028411).
[27] Simin Wang, Xing Chen, Sheng Liu, Fulong Zhu, Xiaogang Liu, “Estimation of homogenized Young's modulus of silicone/phosphor composite considering random dispersion and size variation of phosphor particles”, Journal of Composite Materials, v50, n14, p1981-1988, 2015. (SCI,EI, DOI:10. 1177/0021998315597992).
[28] Youkai Chen, Fulong Zhu*, Hengyou Liao, Shao Song, Sheng Liu, “The effect of temperature on compressive mechanical behavior of SWCNT-Ni”, 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, p633-636, 2012. (EI, DOI:10.1109/ICEPT-HDP. 2012. 6474697).
[29] Youkai Chen, Fulong Zhu*, Hengyou Liao, Shao Song, Sheng Liu, “Compressing Deformation Investigation of Single-Walled Carbon Nanotube Coated with Ni”，the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012, p728-731, 2012. ( EI, DOI:10.1109/EPTC. 2012.6507178).
[30] Youkai Chen, Fulong Zhu, Kai Tang, Ying Li, Hengyou Liao, Sheng Liu, “Mechanical behavior investigation of single-walled carbon nanotubes with one vacancy”, 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, p579-582, 2013. (EI, DOI: 10.1109/ICEPT. 2013.6756537).

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