18luck新利电竞主页平台管理系统 ZHU FU LONG--英文主页--Paper Publications

朱福龙

Recommended Ph.D.Supervisor Recommended MA Supervisor

·Paper Publications

Current position: 英文主页 > Scientific Research > Paper Publications

[11] Liping He, Fulong Zhu*, Yanming Chen, Ke Duan, Xinxin Lin, Yongjun Pan, Jianquan Tao, “Ultrasonic power measurement system based on acousto-optic interaction”, Review of Scientific Instruments, v87, n5, p1-8, 2016.(SCI,EI, DOI: 10.1063/1.4948731).
[12] Liping He, Fulong Zhu*, Yuhong Liu, Sheng Liu, “Investigaton of machining mechanism of monocrystalline silicon in nanometric grinding”, AIP Advances, Vol.7, Issue 5, 2017. (SCI, EI, DOI: 10.1063/1.4983216).
[13] Liping He, Fulong Zhu*，Ke Duan，Kai Tang, Sheng Liu, “Mechanical response of copper nanowires under torsion”, in 2015 16th International Conference on Electronic Packaging Technology, ICEPT2015, p318-322, 2015. (EI, DOI: 10.1109/ICEPT. 2015. 7236600).
[14] Fulong Zhu*, Hengyou Liao, Kai Tang, Youkai Chen, Sheng Liu, “Molecular dynamics study on the effect of temperature on the tensile properties of single-walled carbon nanotubes with a Ni-coating”, Journal of Nanomaterials, v 2015, 2015(SCI, EI, DOI: 10.1155/2015/767182).
[15] Wei Zhang, Fulong Zhu*, Honghai Zhang, Sheng Liu, “An Adjustable Sensitivity Shadow Moiré Technique for Surface Morphology Measurement”, Journal of Modern Optics, v61, n8, p641-649, 2014. (SCI, EI, DOI: 10.1080/09500340. 2014. 904941).
[16] Wei Zhang, Fulong Zhu*, Yiquan Dai, Hengyou Liao, Shao Song, Honghai Zhang, Sheng Liu, “Warpage measurement of silicon wafers of various bonding areas”, in 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP2012, p1164-1167, 2012. ( EI, DOI: 10.1109/ICEPT-HDP.2012.6474814).
[17] Wei Zhang, Fulong Zhu, Shao Song, Honghai Zhang, Sheng Liu, “3-D warpage measurement of silicon wafer”, in 2011 2nd International Conference on Artificial Intelligence, Management Science and Electronic Commerce, AIMSEC 2011, p3603-3605,2011. (EI, DOI: 10.1109/AIMSEC.2011.6010064).
[18] Ying Li, Fulong Zhu*, Yanming Chen, Ke Duan, Kai Tang, Sheng Liu, “Analysis of insertion force of electric connector based on FEM”, 2014 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA2014，p195-198, 2014. (EI, DOI: 10.1109/IPFA.2014.6898160).
[19] Ke Duan, Fulong Zhu*, Kai Tang, Liping He, Yanming Chen, Sheng Liu, “Effect of Chirality and Number of Graphene Layers on the Mechanical Properties of Graphene-Embedded Copper Nanocomposites”, Computational Materials Science, v117, p294-299, 2016.(SCI, EI, DOI: 10.1016/j.commatsci.2016.02.007).
[20] Fulong Zhu*, Ke Duan, Liping He, Kai Tang, Ying Li, Sheng Liu, “Effects of Chirality and Position of Graphene on the Bending Properties of Graphene-Embedded Copper Nanocomposites”, Journal of Nanoscience and Nanotechnology, Vol.17. Issue 5, p3105-3110, 2017 (SCI,EI, DOI: 10.1166/jnn. 2017. 13040).

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