18luck新利电竞主页平台管理系统 WU FENG SHUN--英文主页--Scientific Research

吴丰顺

Recommended Ph.D.Supervisor Recommended MA Supervisor

·Scientific Research

Current position: 英文主页 > Scientific Research

Research Field

No Content

Paper Publications

[1] Chen, Guang ; Liu, Li; Silberschmidt, Vadim V.; Liu, Changqing; Wu, Fengshun; Chan, Y.C.. Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient. Journal of Materials Science: Materials in Electronics, v 29, n 7, p 5253-5263, April 1, 2018
[2] Chen, Guang; Huang, Bomin; Liu, Hui; Chan, Y.C.; Tang, Zirong; Wu, Fengshun. An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder. Soldering and Surface Mount Technology, v 28, n 2, p 84-92, 2016
[3] Peng, Hao; Chen, Guang; Mo, Liping; Chan, Y.C.; Wu, Fengshun; Liu, Hui. An investigation on the ZnO retained ratio, microstructural evolution, and mechanical properties of ZnO doped Sn3.0Ag0.5Cu composite solder joints. Journal of Materials Science: Materials in Electronics, v 27, n 9, p 9083-9093, September 1, 2016
[4] Chen, Guang ; Wu, Fengshun; Liu, Changqing; Silberschmidt, Vadim V.; Chan, Y.C.. Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets. Journal of Alloys and Compounds, v 656, p 500-509, January 25, 2016
[5] Chen, Guang; Wu, Fengshun; Liu, Changqing; Xia, Weisheng; Liu, Hui. Effects of fullerenes reinforcement on the performance of 96.5Sn-3Ag-0.5Cu lead-free solder. Materials Science and Engineering A, v 636, p 484-492, June 01, 2015

Patents

Published Books

Research Projects