18luck新利电竞主页平台管理系统 Liangcheng Tu--英文主页--Paper Publications

Liangcheng Tu

Recommended Ph.D.Supervisor Recommended MA Supervisor

·Paper Publications

Current position: 英文主页 > Scientific Research > Paper Publications

[21] 09 Xiang-Qing Huang, Zhong-Guang Deng, Ya-Fei Xie, Ji Fan, Chen-Yuan Hu, and Liang-Cheng Tu* , Study on Misalignment Angle Compensation during Scale Factor Matching for Two Pairs of Accelerometers in a Gravity Gradient Instrument, Sensors, 18 (2018), 1247. (9pages).
[22] 08 Wen-Jie Wu, Jin-Quan Liu, Ji Fan, Dan-Hua Peng, Hua-Feng Liu, Liang-Cheng Tu*, A nano-g micromachined seismic sensor for levelling-free measurements. Sensors and Actuators A: Physical, 280 (2018), 238-244. (7pages).
[23] 07 Qing Li, Chao Xue, Jian-Ping Liu, Jun-Fei Wu, Shan-Qing Yang, Cheng-Gang Shao, Li-Di Quan, Wen-Hai Tan, Liang-Cheng Tu, Qi Liu, Hao Xu, Lin-Xia Liu, Qing-Lan Wang, Zhong-Kun Hu, Ze-Bing Zhou, Peng-Shun Luo, Shu-Chao Wu, Vadim Milyukov & Jun Luo, Measurements of the gravitational constant using two independent methods. Nature, 560 (2018) 582–588 (7pages).
[24] 06 Wen-Jie Wu，Dan-Dan Liu, Wen-Rui Qiu, Hua-Feng Liu，Fang-Jing Hu, Ji Fan, Chen-Yuan Hu, Liang-Cheng Tu*, A precise spacing-control method in MEMS packaging for capacitive accelerometer applications, J. Micromech. Microeng. 28 (2018) 125016. (8pages) .
[25] 05 Zhong-Guang Deng, Chen-Yuan Hu*, Xiang-Qing Huang, Wen-Jie Wu, Fang-Jing Hu, Hua-Feng Liu and Liang-Cheng Tu*. Scale Factor Calibration for a Rotating Accelerometer Gravity Gradiometer. Sensors. 18(2018)4386. (10 pages).
[26] 04 Hua-Feng Liu, Kai Luo, Shi-Hao Tang, Dan-Hua Peng, Fang-Jing Hu* and Liang-Cheng Tu. An Ultra-Wideband THz/IR Metamaterial Absorber Based on Doped Silicon. Materials, 11(2018) 2590.
[27] 03 Lin Zhu, Qi Liu, Hui-Hui Zhao, Qi-Long Gong, Shan-Qing Yang, Pengshun Luo, Cheng-Gang Shao, Qing-Lan Wang, Liang-Cheng Tu, and Jun Luo. Test of the Equivalence Principle with Chiral Masses Using a Rotating Torsion Pendulum. Phys. Rev. Lett. 121 (2018)261101.
[28] 02 Xiao-Xiao Song, Qiu Wang, Hua-Feng Liu, Guang-Bin Dou, Hao Li, Wen-Jie Wu, Fang-Jing Hu*, Ji Fan, Jin-Quan Liu and Liang-Cheng Tu. A method for alleviating the effect of pinhole defects in inter-metal dielectric films. J. Micromech. Microeng. 29 (2019) 015012. (6pages).
[29] 01 Xiao-Li Wei, Jin-Quan Liu, Hua-Feng Liu, Wen-Jie Wu, Ji Fan and Liang-Cheng Tu*. Electroplating of 3D Sn-rich solder for MEMS packaging applications. J. Micromech. Microeng. 29 (2019) 045008. (7pages).

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