18luck新利电竞主页平台管理系统 CHEN JIAN KUI--英文主页--Paper Publications

陈建魁

Recommended MA Supervisor

·Paper Publications

Current position: 英文主页 > Scientific Research > Paper Publications

[1] Jian-Kui Chen, Hui-Min Liu, Yong-An Huang,Zhou-ping Yin.High-rate roll-to-roll stack and lamination of multilayer structured membrane electrode assembly.[J].Journal of Manufacturing Processes,
[2] Jian-Kui Chen, Zhou-Long Xu, Yong-An Huang,Zhou-ping Yin.Analytical investigation on thermal-induced warpage behavior of ultrathin chip-on-flex (UTCOF) assembly.[J].Science China Technological Sciences,
[3] Wei Tang, Jian-Kui Chen, Zhou-Ping Yin.Elastic buckling analysis of webs transported through rollers with misalignment.[J].Thin-Walled Structures,
[4] Liang Ma, Jian-Kui Chen, Wei Tang,Zhou-ping Yin.Transverse vibration and instability of axially travelling web subjected to non-homogeneous tension.[J].International Journal of Mechanical Sciences,
[5] Liang Ma, Jian-Kui Chen, Wei Tang,Zhou-ping Yin.Jian-Kui Chen.Vibration-based estimation of tension for an axially travelling web in roll-to-roll manufacturing.Measurement Science and Technology,
[6] Jin-Hua Hong, Jian-Kui Chen, Zhou-Long Xu, Zhou-Ping Yin.High-efficiency Revolving-turret Chip Transferring Technology for Flip Chip Packaging.[J].IEEE Transactions on Components, Packaging and Manufacturing Technology,
[7] Liang Ma, Jian-Kui Chen, Wei Tang,Zhou-ping Yin.Jian-Kui Chen.Free Vibration Analysis of an Axially Travelling Web with Intermediate Elastic Supports.[J].Journal of Applied Mechanics,
[8] Hui-Min Liu, Zun-Xu Liu, Zhou-Long Xu, Zhou-Ping Yin, Yong-An Huang, Jian-Kui Chen.Jian-Kui Chen.Competing Fracture of Thin-Chip Transferring from/onto Prestrained Compliant Substrate.[J].Journal of Applied Mechanics,
[9] Yuan-Qi Zeng, Bo Tao, Jian-Kui Chen.Jian-Kui Chen.Temperature-dependent orientation study of the initial growth of pentacene on amorphous SiO2, by molecular dynamics simulations.[J].Journal of Crystal Growth,
[10] in-Hua Hong, Jian-Kui Chen, Zhou-Long Xu, Zhou-Ping Yin.Jian-Kui Chen.Reliable thin chip peeling from adhesive tape with inverted needle ejecting and spring buffering.[J].Journal of Adhesion Science and Technology,

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